AFS250-1FGG256

Overview

The AFS250-1FGG256 is a Fusion family Field Programmable Gate Array manufactured by Microchip Technology. It features 250,000 system gates and 38,400 configurable logic blocks (CLBs). The device operates with a nominal supply voltage of 1.5 V, ranging from 1.425 V to 1.575 V. It supports up to 157 I/Os and is housed in a 256-pin FBGA package with a 1 mm pitch. The industrial temperature grade covers -40°C to +85°C.

Feature Summary

• Integrates mixed-signal capabilities within the Fusion FPGA architecture
• Supports high-density logic implementation via configurable logic blocks
• Compatible with MicroBlade Advanced Mezzanine standards

Applications

• Industrial automation control systems
• Telecommunications infrastructure interfaces
• Embedded processing acceleration

Procurement Notes

Verify component authenticity through authorized Microchip distributors or direct manufacturer channels. Confirm RoHS compliance status and moisture sensitivity level prior to soldering. Ensure proper ESD handling protocols are followed during storage and assembly to maintain device integrity.

Selection Notes

Select this model for designs requiring moderate logic density with mixed-signal integration. Compare against U1AFS250 variants for updated feature sets. Verify pin compatibility with existing 256-pin FBGA footprints. Check thermal requirements against the specified industrial temperature range.

Part Context

This component belongs to the Microchip Fusion series, bridging ASIC performance with FPGA flexibility. It succeeds earlier ProASIC3 devices like the A3P250, offering enhanced logic resources and integrated analog functions. The FG suffix indicates a fine-pitch ball grid array package suitable for surface mount applications.

Replacement Considerations

The U1AFS250-FGG256I serves as a functional successor within the same package footprint. Verify software compatibility when migrating from legacy Fusion tools.