AFS250-2FG256

AFS250-2FG256

$111.10
  • Description:IC FPGA 114 I/O 256FBGA
  • Series:Fusion®

SKU:2c11e510adc4 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC FPGA 114 I/O 256FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:36864
  • Number of I/O:114
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:250000

Download product information

AFS250-2FG256

Overview

The AFS250-2FG256 is a Fusion family Field Programmable Gate Array manufactured by Microchip Technology. It features 250,000 system gates and 6,144 Configurable Logic Blocks (CLBs). The device supports a maximum operating frequency of 350 MHz and includes 0 bits of embedded memory. It utilizes a 256-pin FineLine BGA package with a 1 mm pitch. The component operates within a temperature range of 0°C to 85°C and requires a supply voltage between 1.425V and 1.575V.

Feature Summary

  • Integrates 250K system gates for complex logic implementation
  • Supports high-speed data processing up to 350 MHz
  • Utilizes a compact 256-pin FBGA package for surface mount applications

Applications

  • Industrial control systems requiring programmable logic
  • Mixed-signal FPGA designs leveraging the Fusion architecture
  • Embedded processing interfaces in communication equipment

Procurement Notes

Verify the specific suffix designation against official Microchip documentation to confirm performance grade and package variant. Ensure compliance with export regulations as indicated in product specifications. Confirm moisture sensitivity level handling requirements prior to assembly to maintain device integrity during soldering processes.

Selection Notes

Select this model when 250K gate capacity and 350 MHz speed are required within a 256-pin footprint. Compare against the M1AFS250 series if integrated processor cores are needed instead of pure logic resources. Verify that the standard commercial temperature range meets the operational environment constraints of the target application design.

Part Context

This component belongs to the Microchip Fusion family of mixed-signal FPGAs. It succeeds earlier Actel and Microsemi FPGA portfolios following corporate acquisitions. The part number structure indicates the 250K gate density, speed grade, and 256-ball fine-line ball grid array packaging configuration used in legacy and current compatible designs.

Replacement Considerations

Publicly confirmed substitute part numbers include U1AFS250-FG256I and M1AFS250-2FG256. Verify pinout compatibility and electrical characteristics before substitution. Cross-reference datasheets to ensure functional equivalence in the specific application context.

AFS250-2FG256AFS250-2FG256
$111.10
Buy Now