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The AFS250-2FG256 is a Fusion family Field Programmable Gate Array manufactured by Microchip Technology. It features 250,000 system gates and 6,144 Configurable Logic Blocks (CLBs). The device supports a maximum operating frequency of 350 MHz and includes 0 bits of embedded memory. It utilizes a 256-pin FineLine BGA package with a 1 mm pitch. The component operates within a temperature range of 0°C to 85°C and requires a supply voltage between 1.425V and 1.575V.
Verify the specific suffix designation against official Microchip documentation to confirm performance grade and package variant. Ensure compliance with export regulations as indicated in product specifications. Confirm moisture sensitivity level handling requirements prior to assembly to maintain device integrity during soldering processes.
Select this model when 250K gate capacity and 350 MHz speed are required within a 256-pin footprint. Compare against the M1AFS250 series if integrated processor cores are needed instead of pure logic resources. Verify that the standard commercial temperature range meets the operational environment constraints of the target application design.
This component belongs to the Microchip Fusion family of mixed-signal FPGAs. It succeeds earlier Actel and Microsemi FPGA portfolios following corporate acquisitions. The part number structure indicates the 250K gate density, speed grade, and 256-ball fine-line ball grid array packaging configuration used in legacy and current compatible designs.
Publicly confirmed substitute part numbers include U1AFS250-FG256I and M1AFS250-2FG256. Verify pinout compatibility and electrical characteristics before substitution. Cross-reference datasheets to ensure functional equivalence in the specific application context.