AFS250-2FG256I

Overview

The AFS250-2FG256I is a Fusion field-programmable gate array (FPGA) manufactured by Microchip Technology. It features 250,000 system gates and provides 114 input/output pins within a 256-pin FineLine BGA package measuring 17x17 mm. The device operates on a core voltage ranging from 1.425 V to 1.575 V and supports an industrial temperature range of 0°C to 85°C junction temperature. It includes 36,864 bits of embedded RAM for data storage and logic implementation.

Feature Summary

• Integrates an ARM Cortex-M1 processor core alongside programmable logic fabric for mixed-signal system-on-chip applications.
• Supports high-speed serial communication interfaces including Gigabit Ethernet MAC and PCIe Gen 2/3 endpoints.
• Features advanced security mechanisms with hardware root of trust and secure boot capabilities.

Applications

• Industrial automation controllers requiring deterministic real-time processing.
• Telecommunications infrastructure equipment utilizing high-speed serial protocols.
• Automotive infotainment systems demanding robust security and connectivity.

Procurement Notes

Verify the specific suffix '2' indicates the industrial temperature grade and speed bin during procurement. Confirm RoHS compliance status as some Fusion variants may not meet current environmental directives. Check for export control classifications such as ECCN 3A991D which may require additional documentation for international shipping. Ensure the 256-FPBGA package dimensions match the target PCB footprint requirements.

Selection Notes

Select this component when a combination of FPGA fabric and an embedded microcontroller is required. Compare against the M1AFS250 series for similar logic density but different processor integration. Consider the 256-pin FBGA package constraints for board space limitations. Evaluate power consumption profiles against alternative SRAM-based FPGAs for thermal management in enclosed enclosures.

Part Context

This part belongs to the Microchip Fusion family, designed to merge FPGA flexibility with MCU functionality. It succeeds earlier Actel Fusion products following Microchip's acquisition. The FG256 designation refers to the fine-pitch ball grid array package type used across multiple logic densities in the lineup.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material. Verify compatibility with existing design files before considering any cross-family migration.