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The AFS250-2FGG256 is a Fusion FPGA from Microchip Technology, featuring 250K system gates and 38,400 configurable logic blocks. It operates within a supply voltage range of 1.42V to 1.58V and supports an industrial temperature range of -40°C to +85°C. The device utilizes a 256-pin FBGA package with a 1mm pitch. It includes 36,864 bits of embedded memory and provides 114 I/O pins. This component is part of the Fusion family designed for mixed-signal applications.
Verify the specific suffix '2' indicates the industrial temperature grade (-40°C to +85°C). Confirm the package type matches the required 256-pin FBGA footprint. Check for export compliance requirements as this product may require additional documentation for shipment from the United States. Ensure design-in compatibility with existing PCB layouts before ordering.
Select this model when 250K system gates are sufficient for the design complexity. Compare against the U1AFS250 series if higher gate counts or different performance tiers are needed. Verify that the 114 available I/O pins meet the interface requirements. Consider the 1.5V core voltage constraints during power budget calculations.
This component belongs to the Microchip Fusion FPGA family, which combines high-density programmable logic with embedded processor cores. The AFS250 variant represents the mid-range capacity within this series, offering a balance between resource availability and power efficiency for compact embedded designs.
The M1AFS250-2FG256 serves as a pin-compatible alternative within the same family. Verify functional equivalence regarding embedded memory and I/O configurations before substitution. Cross-reference datasheets to ensure identical package dimensions and electrical characteristics.