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The AFS250-PQG208I is a Fusion mixed-signal Field Programmable Gate Array (FPGA) manufactured by Microsemi Corporation. It features 250,000 system gates and 6,144 tiles within a 208-pin Plastic Quad Flat Pack (PQFP) package with a 0.5 mm pitch. The device operates at a maximum system performance of 350 MHz and supports an industrial temperature range of -40°C to +100°C. Key specifications include 2 Mbits of embedded flash memory, 36 kbits of SRAM, and an integrated 12-bit Analog-to-Digital Converter (ADC). It utilizes a single 3.3 V power supply with an on-chip 1.5 V regulator.
Verify the specific ordering suffix 'I' confirms the industrial temperature grade (-40°C to +100°C) and that the 'Y' indicates inclusion of the Cryptography Research Inc. patent license. Confirm package type PQG208 corresponds to the 208-pin PQFP form factor. Check current availability status as Fusion devices may have limited production runs.
Select this component when a single-chip solution combining digital logic, non-volatile memory, and analog signal processing is required. Ensure the design benefits from Instant On operation and does not require external configuration memory. Verify that the 250,000 gate density and 2 Mbit flash capacity meet the system's logic and storage requirements.
This part belongs to the Fusion family of mixed-signal FPGAs, which combines ProASIC3 flash architecture with analog blocks. It is distinct from standard SRAM-based FPGAs due to its nonvolatile nature and integrated ADC. The PQG208 package variant offers a pin-compatible option within the family, facilitating board design flexibility across different density levels.
Direct pin-compatible replacements within the same package include other Fusion devices like the AFS600 or AFS1500, provided the higher gate counts are acceptable. For lower density needs, the AFS090 may be considered if I/O count permits.