AFS250-QNG180I

Overview

The AFS250-QNG180I is a Fusion mixed-signal Field Programmable Gate Array (FPGA) manufactured by Microsemi Corporation. It features 250,000 system gates and 6,144 configurable logic blocks (CLBs). The device utilizes an advanced 130-nm flash-based CMOS process with seven layers of metal. It operates within an industrial temperature range of -40°C to +100°C junction temperature. The QN180 package provides 180 terminals with a 0.5 mm pitch. Power requirements include a single 3.3 V supply with an on-chip 1.5 V regulator.

Feature Summary

• Integrates high-performance reprogrammable flash technology for instant-on operation without external boot PROMs.
• Includes embedded analog peripherals such as a 12-bit ADC with up to 600 Ksps sampling rate and MOSFET gate driver outputs.
• Supports secure in-system programming using 128-bit AES encryption and FlashLock protection mechanisms.

Applications

• Power management systems requiring integrated voltage monitoring and control.
• Smart battery charging applications utilizing onboard analog sensing capabilities.
• Motor control designs leveraging programmable gate drivers and real-time counters.

Procurement Notes

Verify the specific ordering suffix 'I' confirms the industrial temperature grade (-40°C to +100°C) and 'QN180' denotes the Quad Flat No Lead package. Confirm RoHS compliance status as QN packages are typically offered as RoHS compliant. Ensure design files match the Rev 6 datasheet specifications for pin assignments and electrical characteristics.

Selection Notes

Select this model when a nonvolatile FPGA solution with integrated analog functions is required. The AFS250 density suits moderate complexity logic designs. Consider the QN180 package constraints regarding board space and thermal dissipation. Verify that the 3.3 V single-supply architecture aligns with the target system power rails.

Part Context

This component belongs to the Microsemi Fusion family of mixed-signal FPGAs. It shares architectural similarities with other AFS250 variants but differs in package type and temperature rating. The Fusion series combines flash memory, analog peripherals, and FPGA fabric on a single die, distinguishing it from SRAM-based programmable logic devices.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should consult Microsemi or authorized distributors for current availability and potential obsolescence notices regarding the AFS250 series.