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AFS3-00100400-22-LN is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists L3 Narda-MITEQ. Its product description is IC RF AMP GPS 100MHZ-4GHZ MODULE. Review the specifications below when checking this part for your BOM.
The AFS3-00100400-22-LN is a general-purpose RF amplifier module manufactured by L3 Narda-MITEQ. It operates within a frequency range of 100 MHz to 4 GHz, making it suitable for GPS and broadband applications. The device provides a nominal gain of 22 dB with a P1dB output power of 10 dBm. Key electrical specifications include a noise figure of 2.5 dB and a supply voltage requirement of 15 V. The unit draws a supply current of 150 mA during operation. Packaged in a compact module form factor, this component integrates essential amplification stages into a single reliable unit designed for integration into larger RF systems.
Verify the specific suffix 'LN' against the manufacturer's official datasheet to confirm pinout and performance tolerances. Ensure the 15 V DC supply capability matches your system design. Confirm that the module package dimensions fit your PCB layout constraints before finalizing procurement orders.
Select this model when a 100 MHz to 4 GHz bandwidth is required with moderate gain. Consider the 15 V supply requirement and 150 mA current draw for power budget calculations. Compare the 2.5 dB noise figure against system sensitivity requirements. Verify compatibility with existing RF interfaces and mounting structures.
This component belongs to the AFS3 series of RF amplifier modules from L3 Narda-MITEQ. The series offers various configurations tailored for different frequency ranges and gain levels. The AFS3-00100400-22-LN specifically targets the sub-6 GHz spectrum, providing a balance of gain and noise performance for versatile RF applications.
Consult the official L3 Narda-MITEQ replacement guide for direct equivalents. Verify that any substitute part maintains the 100 MHz to 4 GHz frequency range and compatible 15 V supply requirements. Check for identical module packaging to ensure mechanical interchangeability without redesigning the host circuit board.
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