AFS600-1FG256

AFS600-1FG256

$155.35
  • Description:IC FPGA 119 I/O 256FBGA
  • Series:Fusion®

SKU:88bedab5d4c0 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 119 I/O 256FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:110592
  • Number of I/O:119
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:600000

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AFS600-1FG256

Overview

The AFS600-1FG256 is a non-volatile Flash-based Field Programmable Gate Array (FPGA) from the Microsemi ProASIC3 family, manufactured by Microchip Technology. It features 600,000 system gates and 13,824 configurable logic blocks (CLBs). The device operates within a supply voltage range of 1.425 V to 1.575 V, with a nominal rating of 1.5 V. It supports a maximum system clock frequency of 350 MHz and functions reliably across an industrial temperature range of -40°C to +85°C. The component utilizes a 256-pin FineLine BGA package with a 1 mm pitch.

Feature Summary

  • Live at Power-Up (LAPU) capability ensures immediate operation upon power application without external configuration memory requirements.
  • Non-volatile Flash technology retains programmed design data when powered off, eliminating the need for boot-up configuration cycles.
  • Supports In-System Programming (ISP) and includes on-chip security features such as 128-bit Advanced Encryption Standard (AES) encryption.

Applications

  • Secure embedded control systems requiring instant-on functionality
  • Industrial automation interfaces utilizing 3.3V or 66MHz PCI compliance
  • Low-power portable devices benefiting from non-volatile configuration

Procurement Notes

Verify the specific suffix 'I' if industrial temperature range (-40°C to +85°C) is required, as standard commercial variants may differ. Confirm RoHS status, as older ProASIC3 batches may not comply with current environmental directives. Ensure ESD handling protocols are followed due to the sensitivity of Flash-based FPGA structures during installation.

Selection Notes

Select this model for applications demanding high density in a compact 256-pin footprint. Compare against the M1A3P600 series if ARM Cortex-M1 processor integration is necessary. Verify that the 13,824 CLBs meet logic capacity needs, noting that equivalent gate counts vary between vendors. Check pinout compatibility if replacing legacy Microsemi components.

Part Context

This component belongs to the ProASIC3 Flash FPGA family, bridging the gap between complex FPGAs and simple PLDs. It succeeded earlier ASIC solutions by offering reprogrammability with Flash endurance. The AFS600 variant specifically targets mid-range logic density, providing a cost-effective alternative to SRAM-based FPGAs for volume production where configuration persistence is critical.

Replacement Considerations

Direct functional equivalents include the A3P600-1FG256. For upgraded performance with integrated processors, consider the M1A3P600-1FG256. Cross-family migration to PolarFire or IGloo2 requires schematic and timing analysis due to architectural differences in I/O standards and power management.

AFS600-1FG256AFS600-1FG256
$155.35
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