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The AFS600-2FG484 is a Field Programmable Gate Array from the Microchip Fusion family, featuring 600,000 system gates and 13,824 Configurable Logic Blocks. It utilizes a nonvolatile Flash-based CMOS process with a 130-nm technology node. The device operates on a single 3.3 V supply with an integrated 1.5 V regulator and supports mixed-voltage I/O banks at 1.5 V, 1.8 V, 2.5 V, and 3.3 V. It offers a maximum system frequency of 350 MHz and includes 2 Mb of user Flash memory. The component is housed in a 484-pin FineLine BGA package with a 1.0 mm pitch, rated for industrial temperatures ranging from -40 °C to +85 °C.
Verify the specific suffix '2' indicates the industrial temperature grade (-40°C to +85°C) and speed bin as defined in the official datasheet. Confirm RoHS compliance status, as historical records indicate variations within the AFS600 series. Ensure the 484-pin FBGA footprint matches the target PCB design constraints before ordering.
Select this model when nonvolatile configuration is required to eliminate external PROMs. Compare against the M1AFS600 variant if ARM processor integration is needed. Verify that the 350 MHz performance meets timing requirements. Check I/O voltage compatibility across all banks to ensure signal integrity with connected peripherals.
This component belongs to the Actel Fusion mixed-signal FPGA family, which integrates standard FPGA logic with embedded Flash memory. The AFS600 represents the 600K gate density tier within this lineup. It succeeded earlier ProASIC technologies and was later incorporated into Microchip Technology's portfolio following the acquisition of Actel.
The AFS600-1FG484 serves as the commercial temperature version of this device. For designs requiring embedded processing, the M7AFS600-2FG484I provides similar logic density with an added ARM core. Direct pin-compatible upgrades may require firmware adaptation due to architectural differences.