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The AFS600-FG256 is a Fusion field-programmable gate array (FPGA) manufactured by Microchip Technology. It features 119 input/output terminals and utilizes a 256-pin FBGA package with a 17x17 mm footprint. The device operates within a supply voltage range of 1.425 V to 1.575 V, centered at 1.5 V nominal. It supports an industrial temperature range from -40°C to +100°C junction temperature. The FPGA contains approximately 600,000 system gates and includes 110,592 bits of total RAM for embedded memory applications.
Verify the specific suffix designation when ordering, as variations such as -I indicate extended temperature ranges. Confirm RoHS compliance status directly with the manufacturer or authorized distributors, as certain revisions may not meet current environmental standards. Ensure that the required packaging format matches the procurement specification, typically supplied in trays for this package type.
Select this component for designs requiring moderate logic density with integrated processing capabilities. Compare against the M1AFS600 series if additional embedded memory resources are necessary. Verify that the 256-pin FBGA package fits the target PCB layout constraints. Ensure the design toolchain supports the specific Fusion family generation for successful compilation and implementation.
This part belongs to the Microchip Fusion FPGA family, which combines programmable logic with embedded ARM cores. It succeeds earlier ProASIC3 flash FPGA technologies while offering enhanced performance and lower power consumption. The AFS600 variant represents a mid-range capacity option within the Fusion portfolio, balancing resource availability with cost efficiency for complex digital logic applications.
The M1AFS600-FG256I serves as a verified functional substitute within the same package and pinout configuration. Both devices share identical gate counts and I/O configurations, ensuring compatibility in existing board layouts without requiring schematic modifications.