AFS600-FG256I

AFS600-FG256I

$247.04
  • Description:IC FPGA 119 I/O 256FBGA
  • Series:Fusion®

SKU:aeb7f53a0817 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 119 I/O 256FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:110592
  • Number of I/O:119
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:600000

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AFS600-FG256I

Overview

The AFS600-FG256I is a Fusion FPGA from Microchip Technology, featuring 600,000 system gates and 119 I/Os. It operates within a supply voltage range of 1.425V to 1.575V, with a nominal operating voltage of 1.5V. The device supports a maximum frequency of 1.28205 GHz and includes 110,592 bits of total RAM. It is housed in a 256-LBGA package (17x17mm) and functions across a temperature range of -40°C to 100°C TJ.

Feature Summary

  • Integrates an ARM Cortex-M7 processor core for embedded control applications
  • Provides high-density programmable logic with significant system gate capacity
  • Supports advanced security features including AES encryption and secure boot

Applications

  • Industrial automation controllers requiring mixed-signal processing
  • Automotive infotainment systems with safety-critical requirements
  • Telecommunications infrastructure equipment needing low power consumption

Procurement Notes

Verify the specific revision level and manufacturing date code against project requirements before procurement. Confirm compliance with export control regulations, as this product may require additional documentation for international shipping. Ensure that the 256-LBGA footprint matches the PCB design specifications exactly to avoid assembly issues.

Selection Notes

Select this model when a combination of high-performance FPGA fabric and an integrated ARM processor is required. Compare the 600K gate count and 110Kbit RAM against alternative devices if larger memory or different I/O counts are needed. Consider the 256-pin FBGA package constraints during thermal and mechanical design phases.

Part Context

This component belongs to the Microchip Fusion family, which combines SRAM-based FPGA technology with embedded processors. It is part of a broader portfolio that includes variants like M1AFS600 and M7AFS600, differentiated by their integrated processor cores and feature sets. The FG256I suffix indicates the industrial temperature grade and 256-pin package.

Replacement Considerations

Direct pin-to-pin replacements include other members of the Fusion family such as M1AFS600-FG256I or M7AFS600-1FGG256I, provided the specific processor core requirements align. Verify that any substitute maintains the same 256-LBGA footprint and electrical characteristics.

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