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The AFS600-FG256I is a Fusion FPGA from Microchip Technology, featuring 600,000 system gates and 119 I/Os. It operates within a supply voltage range of 1.425V to 1.575V, with a nominal operating voltage of 1.5V. The device supports a maximum frequency of 1.28205 GHz and includes 110,592 bits of total RAM. It is housed in a 256-LBGA package (17x17mm) and functions across a temperature range of -40°C to 100°C TJ.
Verify the specific revision level and manufacturing date code against project requirements before procurement. Confirm compliance with export control regulations, as this product may require additional documentation for international shipping. Ensure that the 256-LBGA footprint matches the PCB design specifications exactly to avoid assembly issues.
Select this model when a combination of high-performance FPGA fabric and an integrated ARM processor is required. Compare the 600K gate count and 110Kbit RAM against alternative devices if larger memory or different I/O counts are needed. Consider the 256-pin FBGA package constraints during thermal and mechanical design phases.
This component belongs to the Microchip Fusion family, which combines SRAM-based FPGA technology with embedded processors. It is part of a broader portfolio that includes variants like M1AFS600 and M7AFS600, differentiated by their integrated processor cores and feature sets. The FG256I suffix indicates the industrial temperature grade and 256-pin package.
Direct pin-to-pin replacements include other members of the Fusion family such as M1AFS600-FG256I or M7AFS600-1FGG256I, provided the specific processor core requirements align. Verify that any substitute maintains the same 256-LBGA footprint and electrical characteristics.