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AFSC5G23E37T2 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is AIRFAST POWER AMPLIFIER MODULE,. Review the specifications below when checking this part for your BOM.
The AFSC5G23E37T2 is an Airfast power amplifier module from NXP Semiconductors, designed for wireless infrastructure applications. It operates within the 2300-2400 MHz frequency range and delivers a typical gain of 37 dB with an average output power of 5 W. The component utilizes silicon technology and is housed in a 26-pin HLQFN package (10x6 mm) suitable for surface mount installation. It supports a supply voltage range of 24 V to 31 V and features a maximum operating temperature of +125°C. The module is moisture sensitive (MSL Level 3) and complies with RoHS standards.
Verify current lifecycle status as availability may vary. Confirm package variant matches design requirements. Check moisture sensitivity handling procedures during storage and assembly. Ensure compliance with regional environmental regulations such as RoHS. Validate supplier authorization for genuine components.
Consider the specific frequency band requirements for the target application. Evaluate thermal management needs due to the high operating temperature rating. Assess board space constraints against the HLQFN package dimensions. Verify supply voltage compatibility with existing system power rails. Review gain specifications to ensure adequate signal amplification.
This part belongs to the AFSC5G series of Airfast power amplifier modules. These components are engineered for modern wireless communication standards requiring high linearity and efficiency. The series includes variants tailored for different frequency bands and power levels, all sharing similar integration benefits.
Public confirmed substitute part numbers are not available in the provided documentation. Consult official NXP resources for potential obsolescence alternatives or direct replacements.
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