RF Amplifiers AFSC5G23E37T2 product image

AFSC5G23E37T2

  • Description:AIRFAST POWER AMPLIFIER MODULE,
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:927477262606 Category: Brand:

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AFSC5G23E37T2 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is AIRFAST POWER AMPLIFIER MODULE,. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for AFSC5G23E37T2

  • Description:AIRFAST POWER AMPLIFIER MODULE,
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Frequency:2.3GHz ~ 2.4GHz
  • P1dB:-
  • Gain:35dB
  • Noise Figure:-
  • RF Type:5G, LTE
  • Voltage - Supply:24V ~ 30V
  • Current - Supply:-
  • Test Frequency:2.3GHz, 2.4GHz
  • Mounting Type:Surface Mount
  • Package / Case:26-LQFN Exposed Pad
  • Supplier Device Package:26-HLQFN (10x6)
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for AFSC5G23E37T2

AFSC5G23E37T2

RF Amplifiers Overview

The AFSC5G23E37T2 is an Airfast power amplifier module from NXP Semiconductors, designed for wireless infrastructure applications. It operates within the 2300-2400 MHz frequency range and delivers a typical gain of 37 dB with an average output power of 5 W. The component utilizes silicon technology and is housed in a 26-pin HLQFN package (10x6 mm) suitable for surface mount installation. It supports a supply voltage range of 24 V to 31 V and features a maximum operating temperature of +125°C. The module is moisture sensitive (MSL Level 3) and complies with RoHS standards.

RF Amplifiers Feature Summary

  • Fully integrated Doherty architecture optimized for high efficiency in wireless infrastructure
  • Airfast technology providing robust performance in demanding RF environments
  • Compact surface-mount packaging facilitating automated assembly processes

RF Amplifiers Applications

  • Base station transmitters
  • Wireless infrastructure systems
  • Broadband communication networks

RF Amplifiers Procurement Notes

Verify current lifecycle status as availability may vary. Confirm package variant matches design requirements. Check moisture sensitivity handling procedures during storage and assembly. Ensure compliance with regional environmental regulations such as RoHS. Validate supplier authorization for genuine components.

RF Amplifiers Selection Notes

Consider the specific frequency band requirements for the target application. Evaluate thermal management needs due to the high operating temperature rating. Assess board space constraints against the HLQFN package dimensions. Verify supply voltage compatibility with existing system power rails. Review gain specifications to ensure adequate signal amplification.

RF Amplifiers Part Context

This part belongs to the AFSC5G series of Airfast power amplifier modules. These components are engineered for modern wireless communication standards requiring high linearity and efficiency. The series includes variants tailored for different frequency bands and power levels, all sharing similar integration benefits.

RF Amplifiers Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official NXP resources for potential obsolescence alternatives or direct replacements.

AFSC5G23E37T2AFSC5G23E37T2

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