RF Amplifiers AFSC5G26D37T1 product image

AFSC5G26D37T1

  • Description:IC AMP 5G 2.496-2.69GHZ 26HLQFN
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:39d743aa910c Category: Brand:

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AFSC5G26D37T1 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC AMP 5G 2.496-2.69GHZ 26HLQFN. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for AFSC5G26D37T1

  • Description:IC AMP 5G 2.496-2.69GHZ 26HLQFN
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Frequency:2.496GHz ~ 2.69GHz
  • P1dB:-
  • Gain:28.3dB
  • Noise Figure:-
  • RF Type:5G, LTE
  • Voltage - Supply:0V ~ 32V
  • Current - Supply:-
  • Test Frequency:-
  • Mounting Type:Surface Mount
  • Package / Case:26-LQFN Exposed Pad
  • Supplier Device Package:26-HLQFN (10x6)
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for AFSC5G26D37T1

AFSC5G26D37T1

RF Amplifiers Overview

The AFSC5G26D37T1 is a fully integrated Doherty power amplifier module designed for wireless infrastructure applications requiring high efficiency and linearity. It operates within the 2496-2690 MHz frequency range, delivering 27 dB of gain and supporting 5 W average output power. The component utilizes a 26-HLQFN (10x6) surface-mount package with exposed pads for thermal management. It is engineered to meet the stringent performance demands of modern cellular base station architectures.

RF Amplifiers Feature Summary

  • Fully integrated Doherty architecture for enhanced efficiency
  • Optimized for high-linearity wireless infrastructure signals
  • Surface-mount design with exposed thermal pad

RF Amplifiers Applications

  • Wireless infrastructure base stations
  • Cellular network coverage expansion
  • High-efficiency RF signal amplification

RF Amplifiers Procurement Notes

Verify the specific suffix T1 against official NXP documentation to confirm exact reel packaging and tape-and-reel specifications. Ensure compatibility with HLQFN26 footprint requirements during procurement planning. Cross-reference material declarations and RoHS compliance status directly with the manufacturer's current datasheet to guarantee adherence to environmental standards for your specific manufacturing process.

RF Amplifiers Selection Notes

Select this module when system requirements demand a pre-integrated Doherty solution in the 2.5 GHz band. Evaluate thermal dissipation capabilities due to the 5 W average power rating. Confirm that the 26-HLQFN package dimensions fit within the available PCB real estate. Consider the integration benefits over discrete designs for simplified biasing and impedance matching networks.

RF Amplifiers Part Context

This component belongs to the AFSC5G series of power amplifier modules from NXP USA Inc. The series targets 5G and LTE infrastructure markets. Similar models include the AFSC5G26E38 and AFSC5G23D37, which offer varying gain and power levels within adjacent or overlapping frequency bands for flexible system design options.

RF Amplifiers Replacement Considerations

Public confirmed substitute part numbers are not explicitly documented in the provided source material. Verify end-of-life status and availability through authorized distributors. Consult NXP technical support for validated alternative components if this specific variant is discontinued.

AFSC5G26D37T1AFSC5G26D37T1

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