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AFSC5G26E38T2 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is AIRFAST POWER AMPLIFIER MODULE,. Review the specifications below when checking this part for your BOM.
The AFSC5G26E38T2 is a fully integrated Doherty power amplifier module designed for wireless infrastructure applications. It operates within the frequency range of 2496 MHz to 2690 MHz, providing a gain of 35 dB and an average output power of 6 W. The device utilizes Silicon technology and is housed in a 26-pin HLQFN (10x6 mm) surface-mount package. It supports a supply voltage range of 24 V to 31 V and functions at temperatures up to +125°C.
Verify component authenticity through authorized NXP channels. Confirm RoHS compliance status prior to integration. Ensure ESD handling protocols are followed during assembly due to moisture sensitivity classification. Validate thermal management solutions align with the maximum operating temperature specification of +125°C for reliable long-term performance.
Select this module when high linearity and efficiency are required in the 2.5 GHz band. The integrated Doherty design simplifies biasing compared to discrete solutions. Consider the 26-pin HLQFN footprint for PCB layout constraints. Evaluate thermal dissipation capabilities against system heat sink designs to maintain junction temperatures within safe limits under continuous operation.
This part belongs to the AFSC5G series of Airfast power amplifier modules from NXP Semiconductors. These components target modern cellular infrastructure needs, offering compact integration. The T2 suffix typically denotes tape and reel packaging for automated manufacturing processes, distinguishing it from bulk or evaluation variants.
Publicly confirmed substitute part numbers are not available in the provided documentation. Consult NXP technical support for direct replacements or pin-compatible alternatives that meet identical electrical specifications.
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