RF Amplifiers AFSC5G26F38T2 product image

AFSC5G26F38T2

  • Description:AIRFAST POWER AMPLIFIER MODULE,
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:3b7a7cc01e8e Category: Brand:

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AFSC5G26F38T2 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is AIRFAST POWER AMPLIFIER MODULE,. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for AFSC5G26F38T2

  • Description:AIRFAST POWER AMPLIFIER MODULE,
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Frequency:2.496GHz ~ 2.69GHz
  • P1dB:-
  • Gain:36.7dB
  • Noise Figure:-
  • RF Type:5G, LTE
  • Voltage - Supply:24V ~ 30V
  • Current - Supply:-
  • Test Frequency:2.69GHz
  • Mounting Type:Surface Mount
  • Package / Case:26-LQFN Exposed Pad
  • Supplier Device Package:26-HLQFN (10x6)
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for AFSC5G26F38T2

AFSC5G26F38T2

RF Amplifiers Overview

The AFSC5G26F38T2 is a fully integrated Doherty power amplifier module designed for wireless infrastructure applications. It operates within the frequency range of 2496 MHz to 2690 MHz, delivering an average output power of 6 W with a gain of 35 dB. The device requires a supply voltage between 24 V and 31 V and utilizes Silicon technology. Packaged in a 26-HLQFN (10x6) surface-mount housing, it supports high-performance requirements for LTE and 5G base station architectures.

RF Amplifiers Feature Summary

  • Fully integrated Doherty architecture optimized for linear amplification
  • Designed for high-efficiency operation in wireless infrastructure environments
  • Surface-mount package suitable for automated PCB assembly processes

RF Amplifiers Applications

  • LTE base station transmitter modules
  • 5G New Radio infrastructure equipment
  • Wireless communication system power amplification

RF Amplifiers Procurement Notes

Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm RoHS compliance documentation matches current regulatory standards. Validate datasheet revisions against design specifications prior to integration. Ensure supply chain stability given potential discontinuation risks associated with legacy inventory management.

RF Amplifiers Selection Notes

Evaluate thermal dissipation requirements for the HLQFN package within the target enclosure design. Verify bias circuit compatibility with the specified 24 V to 31 V operating range. Assess linearity performance metrics against system link budget requirements. Consider footprint constraints relative to the 26-pin LQFN outline dimensions during layout phase.

RF Amplifiers Part Context

This component belongs to the AFSC5 series of radio frequency power amplifier modules from NXP Semiconductors. The series targets macro and micro cell base station applications requiring high efficiency and linearity. The specific model variant integrates matching networks and protection circuits within the single package solution.

RF Amplifiers Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. The manufacturer indicates this product is subject to obsolescence. Designers should consult official NXP lifecycle notices for recommended alternatives or next-generation replacements.

AFSC5G26F38T2AFSC5G26F38T2

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