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AFSC5G35E38T2 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is AIRFAST POWER AMPLIFIER MODULE,. Review the specifications below when checking this part for your BOM.
The AFSC5G35E38T2 is a fully integrated Doherty power amplifier module from NXP Semiconductors, designed for wireless infrastructure applications. It operates within the frequency range of 3400 MHz to 3700 MHz. The device provides an average output power of 7 W and a gain of 31.1 dB. It functions with a supply voltage between 24 V and 31 V. The component utilizes Silicon (Si) technology and is housed in a 26-pin HLQFN package suitable for surface mount installation. It supports a maximum operating temperature of +125 °C.
Verify current availability status as this product may be subject to end-of-life restrictions or discontinuation by the manufacturer. Confirm that the specific tape and reel packaging matches your automated assembly requirements. Ensure compatibility with the required 24 V to 31 V supply rails and thermal management solutions for the HLQFN-26 package before finalizing procurement orders.
Select this module for applications requiring a fully integrated solution in the 3.4-3.7 GHz range. Consider the 7 W average power and 31.1 dB gain specifications against system link budget requirements. Evaluate the HLQFN-26 footprint for PCB layout constraints. Verify that the silicon-based technology meets the thermal and reliability standards for the intended wireless infrastructure deployment environment.
This component belongs to the AFSC5G35E38 series of Airfast power amplifier modules. It shares architectural similarities with other devices in the family, such as the AFSC5G35E37T2, which offers comparable integration but may differ in specific power or gain parameters. These modules are engineered to simplify design complexity for base station transmitters.
Publicly confirmed substitute part numbers are not available in the provided documentation. Check with the manufacturer for potential obsolescence management options or recommended upgrades if this component is discontinued.
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