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AGFA012R24B2E2V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2486FBGA. Review the specifications below when checking this part for your BOM.
The AGFA012R24B2E2V is an Agilex 7 F-Series Field Programmable Gate Array featuring 1,178,000 logic elements. It integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology and NEON multimedia extensions. The device supports operation up to 1.4 GHz and includes 256 KB of embedded RAM. It utilizes a 2340-ball flip-chip ball-grid array package with exposed pads, designed for high-performance computing and complex digital logic applications requiring integrated processing capabilities.
Verify the specific suffix B2 against official Intel/Altera documentation to confirm temperature grade and packaging details, as suffix variations define functional parameters. Confirm moisture sensitivity level handling requirements prior to assembly. Ensure sourcing channels provide valid traceability and authenticity certificates for this programmable logic component.
Select this model when a combination of substantial FPGA logic capacity and embedded ARM processing is required within a single device. Consider the 2340-ball package constraints for PCB layout and thermal management. Evaluate power consumption profiles at target clock speeds relative to available cooling solutions and board design capabilities.
This component belongs to the Agilex 7 F-Series family, representing Intel's advanced programmable logic architecture. The series combines traditional FPGA flexibility with embedded processor cores, targeting applications demanding both parallel processing and sequential control. It succeeds previous generations by offering improved performance per watt and enhanced connectivity options.
Direct replacements must match the 2340-ball FBGA footprint and pinout. Verify that alternative Agilex 7 variants maintain compatible I/O standards and logic density. Cross-reference pin assignments carefully, as minor suffix changes may alter electrical characteristics or package dimensions without changing the physical form factor.
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