AGFA019R24C2I2V

Soc System On Chip Overview

The AGFA019R24C2I2V is an Agilex F Series System-on-Chip FPGA featuring a quad-core ARM Cortex-A53 processor with CoreSight, NEON, and floating-point units. It integrates 1.9 million logic elements and 256KB of RAM. The device operates at speeds up to 1.4GHz and supports 480 I/Os within a 3184-ball BGA package. It includes peripherals such as DMA and WDT, with connectivity options including Ethernet, USB OTG, SPI, and UART.

Soc System On Chip Feature Summary

• Integrated quad-core ARM Cortex-A53 MPCore processor with CoreSight
• Hybrid architecture combining 1.9M logic elements with embedded processing
• Support for high-speed serial interfaces and multiple peripheral protocols

Soc System On Chip Applications

• Industrial automation controllers requiring real-time processing
• Network infrastructure equipment with embedded control planes
• Medical imaging systems needing combined signal processing and compute
• Automotive infotainment and instrument clusters

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official Altera documentation to confirm package type, temperature range, and speed grade. Ensure compatibility with existing board designs regarding pinout and power requirements. Confirm moisture sensitivity level handling procedures during assembly. Check for any recent Product Change Notices affecting labeling or design specifications.

Soc System On Chip Selection Notes

Select this component when a unified solution for programmable logic and application processing is required. The Agilex F series offers optimized performance for mixed-signal and digital processing tasks. Evaluate thermal management needs given the 1.4GHz operating frequency. Consider the available IP libraries for Ethernet and PCIe if high-speed data transfer is critical for the target application.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series family, designed for mid-to-high-end applications. It bridges the gap between traditional FPGAs and processors by integrating hard ARM cores. The R24C package designation indicates a specific ball grid array configuration suitable for dense PCB layouts. It serves as a key component in systems demanding both flexibility and deterministic processing.

Soc System On Chip Replacement Considerations

Direct substitutes within the same package and pinout are limited. Upgrading to higher logic density models in the Agilex F series may require schematic changes. Cross-family migration to Agilex I series requires significant redesign due to architectural differences. Verify that alternative parts support the same ARM core configuration and peripheral sets.