AGFA019R24C2I3E

Soc System On Chip Overview

The AGFA019R24C2I3E is an Agilex 7 F-Series System on Chip FPGA featuring a four-core ARM Cortex-A53 processor with CoreSight, NEON, and floating-point support. It integrates approximately 1.9 million logic elements within a 3184-ball BGA package. The device operates at speeds up to 1.4 GHz and includes 256 KB of embedded RAM. It supports industrial temperature ranges from -40°C to 100°C TJ and offers extensive connectivity including Ethernet, USB OTG, and SPI interfaces.

Soc System On Chip Feature Summary

• Integrated quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point capabilities
• High-density FPGA fabric with approximately 1.9 million logic elements
• Comprehensive peripheral connectivity supporting Ethernet, USB OTG, and standard serial protocols
• Industrial-grade operating temperature range for robust environmental performance

Soc System On Chip Applications

• Industrial automation controllers requiring real-time processing and programmable logic
• Telecommunications infrastructure equipment utilizing high-speed interface standards
• Medical imaging systems demanding precise data acquisition and processing
• Automotive infotainment and instrument cluster platforms

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official Altera documentation to confirm exact package dimensions, thermal characteristics, and moisture sensitivity levels. Confirm availability status through authorized distributors as supply conditions may vary by region. Ensure compliance with RoHS directives and check for any recent product change notices regarding labeling or design revisions before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this component when a combined application processor and reconfigurable logic solution is required within the Agilex 7 family. Compare logic element counts and I/O pin availability against alternative models like the AGFA012 or AGFA027 series to match system complexity. Verify that the 3184-BGA footprint fits the target PCB layout and that the 1.4 GHz performance meets timing requirements for the intended software and hardware tasks.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series, designed for mid-range applications balancing performance and power efficiency. It sits between lower-density variants and higher-capacity models in the portfolio. The R24C designation indicates a specific package and speed grade combination within the broader Agilex ecosystem, targeting cost-sensitive yet high-performance embedded markets.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and electrical specifications are limited due to unique suffix variations. Consider adjacent density parts like the AGFA012R24C2I3E for lower resource needs or the AGFA027R24C2I3E for higher capacity, provided the pinout and thermal constraints remain compatible. Always validate mechanical fit and firmware compatibility when migrating between different logic densities.