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The AGFA027R24C2E2V is an Agilex F series System on Chip FPGA featuring a 2.7M logic element array and a quad-core ARM Cortex-A53 processor running at 1.4GHz. It integrates 256KB of RAM, supports up to 744 I/Os, and operates within a junction temperature range of -40°C to 100°C. The device utilizes a 2340-ball BGA package with exposed pads.
Verify the specific suffix codes against official Altera documentation to confirm pinout compatibility and electrical characteristics. Confirm moisture sensitivity level handling requirements prior to assembly. Ensure design tools support the Agilex F family architecture for proper configuration file generation.
Select this model when high logic density is required alongside embedded processing power. Compare I/O counts and package dimensions against board layout constraints. Evaluate thermal management needs given the operating temperature range and power consumption profiles typical of 2.7M LE devices.
This component belongs to the Intel Agilex 7 F series, designed for applications demanding both programmable logic flexibility and hard processor system integration. It represents a mid-range option within the Agilex portfolio, balancing performance with power efficiency for complex embedded designs.
Direct substitutes within the same package and pinout must be verified through official cross-reference lists. Consider Agilex F series variants with differing logic densities if form factor compatibility allows. Validate software toolchain compatibility before transitioning to alternative part numbers.