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The AGFA027R24C2E2VB is an Agilex F series System-on-Chip FPGA featuring approximately 2.7 million logic elements. It integrates a quad-core ARM Cortex-A53 processor with CoreSight, NEON, and floating-point capabilities. The device operates at speeds up to 1.4 GHz and includes 256 KB of embedded RAM. It utilizes a 3184-ball BGA package measuring 56x45 mm with exposed pads, supporting industrial temperature ranges.
Verify the specific suffix codes against official Altera documentation to confirm exact package dimensions, thermal characteristics, and environmental ratings. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Ensure compatibility with existing ECAD models for footprint verification. Check for any recent product change notices regarding labeling or material composition updates.
Select this component when a unified solution combining high-performance soft-core processing with massive parallel logic is required. Compare pin counts and I/O voltage requirements against alternative Agilex variants. Evaluate thermal dissipation needs based on the 3184-BGA package constraints. Ensure design tools support the specific Agilex F series architecture and IP libraries.
This part belongs to the Intel Agilex 7 F family, designed for mid-to-high-end applications balancing compute density and power efficiency. It sits alongside other Agilex variants offering different logic capacities and interface options. The family emphasizes integration of hard processor systems within programmable logic fabrics for heterogeneous computing tasks.
The integrated quad-core ARM Cortex-A53 processor supports clock speeds up to 1.4 GHz.
Yes, the SoC includes 256 KB of embedded RAM for processor use.
It uses a 3184-ball Ball Grid Array (BGA) package with dimensions of 56x45 mm and exposed pads.