AGFA027R24C2I1VB

AGFA027R24C2I1VB

$31,972.89
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:860a26703f7f Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.7M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFA027R24C2I1VB

Overview

The AGFA027R24C2I1VB is an Agilex F series System-on-Chip FPGA featuring a hybrid architecture with 2,692,000 logic elements and an integrated quad-core ARM Cortex-A53 processor running at 1.4 GHz. It includes 256 KB of embedded RAM and supports up to 744 I/Os. The device operates within a junction temperature range of -40°C to 100°C and utilizes a 2340 FBGA package.

Feature Summary

  • Hybrid SoC architecture combining high-density programmable logic with embedded ARM processing cores
  • Integrated quad-core ARM Cortex-A53 MPCore with NEON and floating-point capabilities
  • Support for diverse peripheral interfaces including Ethernet, USB OTG, and SPI

Applications

  • High-performance industrial automation controllers
  • Advanced telecommunications infrastructure equipment
  • Complex embedded systems requiring mixed signal processing and control

Procurement Notes

Verify the specific suffix configuration against official Altera documentation to ensure correct speed grade and operating temperature range. Confirm moisture sensitivity level (MSL) requirements and handling precautions prior to assembly. Cross-reference the manufacturer part number with authorized distributor catalogs to validate current product status and availability constraints.

Selection Notes

Select this component for designs requiring significant parallel processing alongside deterministic software execution on a single die. Evaluate the 2.7M LE capacity against design resource utilization metrics. Ensure the 2340 FBGA footprint and pin count align with the target PCB layout and thermal management strategy for the intended application environment.

Part Context

This part belongs to the Intel Agilex 7 F family, designed for mid-to-high-end applications balancing performance and power efficiency. It represents a convergence of traditional FPGA flexibility with embedded processor convenience, targeting markets demanding compact, high-throughput solutions without separate controller components.

AGFA027R24C2I1VBAGFA027R24C2I1VB
$31,972.89
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