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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AGFA027R24C2I1VB is an Agilex F series System-on-Chip FPGA featuring a hybrid architecture with 2,692,000 logic elements and an integrated quad-core ARM Cortex-A53 processor running at 1.4 GHz. It includes 256 KB of embedded RAM and supports up to 744 I/Os. The device operates within a junction temperature range of -40°C to 100°C and utilizes a 2340 FBGA package.
Verify the specific suffix configuration against official Altera documentation to ensure correct speed grade and operating temperature range. Confirm moisture sensitivity level (MSL) requirements and handling precautions prior to assembly. Cross-reference the manufacturer part number with authorized distributor catalogs to validate current product status and availability constraints.
Select this component for designs requiring significant parallel processing alongside deterministic software execution on a single die. Evaluate the 2.7M LE capacity against design resource utilization metrics. Ensure the 2340 FBGA footprint and pin count align with the target PCB layout and thermal management strategy for the intended application environment.
This part belongs to the Intel Agilex 7 F family, designed for mid-to-high-end applications balancing performance and power efficiency. It represents a convergence of traditional FPGA flexibility with embedded processor convenience, targeting markets demanding compact, high-throughput solutions without separate controller components.