AGFA027R24C3E4X

Overview

The AGFA027R24C3E4X is an Agilex 7 F-Series FPGA featuring 2,692,000 logic elements. It utilizes a 3184-BGA package with 56x45mm dimensions and supports industrial temperature ranges from 0°C to 100°C TJ. The device exhibits moisture sensitivity level 3 (168 hours) and integrates embedded memory configurations alongside high-speed I/O capabilities for complex programmable logic applications.

Feature Summary

• Agilex 7 F-Series architecture with 2.7M logic elements
• High-density 3184-ball BGA packaging
• Industrial operating temperature range support
• Moisture sensitivity level 3 compliance

Applications

• High-performance programmable logic systems
• Complex digital signal processing implementations
• Advanced interconnect and protocol bridging
• Custom hardware acceleration modules

Procurement Notes

Verify component authenticity through authorized distribution channels. Confirm RoHS compliance status via official datasheets. Ensure proper handling procedures are followed due to specified moisture sensitivity ratings. Validate package markings against manufacturer specifications prior to integration into production workflows.

Selection Notes

Select this model for designs requiring substantial logic capacity within the Agilex 7 family. Consider the 3184-BGA footprint for board space constraints. Evaluate thermal management requirements for the 0°C to 100°C operating range. Compare logic element density against alternative series members for optimal resource utilization.

Part Context

This component belongs to the Altera Agilex 7 F-Series, representing a high-end programmable logic solution. The R24C designation indicates specific performance and package characteristics within the broader product line. It serves as a scalable option for demanding embedded logic applications requiring significant computational resources.

Replacement Considerations

Publicly confirmed substitutes include other Agilex 7 F-Series variants such as AGFA027R24C3I3E and AGFA027R24C3E3V. Verify pin compatibility and electrical parameters before substitution. Ensure functional equivalence regarding logic density and package dimensions for direct replacement scenarios.