AGFA027R25A2E2VAA

Overview

The AGFA027R25A2E2VAA is an Agilex F-series System on Chip featuring a 2.7 million logic element FPGA fabric and a quad-core ARM Cortex-A53 processor running at 1.4 GHz. It integrates 256 KB of RAM, supports up to 720 I/Os, and includes CoreSight debug infrastructure. The device operates within a junction temperature range of 0°C to 100°C and utilizes a 3184-ball BGA package.

Feature Summary

• Integrated quad-core ARM Cortex-A53 MPCore with NEON and floating-point support
• High-density FPGA fabric with 2.7 million logic elements
• On-chip memory including 256 KB RAM and DMA/WDT peripherals
• Comprehensive connectivity interfaces including Ethernet, USB OTG, and SPI

Applications

• High-performance embedded computing systems requiring mixed programmable logic and processing
• Industrial automation controllers utilizing real-time processing capabilities
• Network infrastructure equipment leveraging integrated Ethernet and high-speed I/O
• Automotive infotainment and instrument cluster platforms

Procurement Notes

Verify the specific suffix configuration against official Altera documentation to ensure correct package type and thermal specifications. Confirm moisture sensitivity level requirements for manufacturing processes. Check for any recent Product Change Notices regarding labeling or design revisions that may affect integration.

Selection Notes

Select this component when both substantial FPGA logic capacity and complex application processing are required in a single die. Compare pin counts and I/O voltage levels against system interface requirements. Ensure the 3184-ball BGA footprint and thermal dissipation characteristics align with the target PCB design constraints.

Part Context

This part belongs to the Intel Agilex 7 F-Series family, designed for applications demanding high performance and low power consumption. It combines traditional FPGA flexibility with hard processor system capabilities, enabling heterogeneous computing architectures suitable for advanced edge computing and data center acceleration tasks.