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The AGFA027R25A2E3E is an Agilex 7 F-Series System-on-Chip FPGA featuring approximately 2.7 million logic elements and a quad-core ARM Cortex-A53 processor running at 1.4 GHz. It integrates 256 KB of RAM, supports up to 720 I/Os, and operates within a junction temperature range of 0°C to 100°C. The device utilizes a 3184-ball BGA package with dimensions of 56x45 mm and includes CoreSight debug capabilities.
Verify the specific suffix E3E against official Altera documentation to confirm pinout, speed grade, and environmental ratings. Confirm moisture sensitivity level (MSL) requirements and pre-bake procedures before PCB assembly. Ensure ECAD models match the exact package variant for accurate footprint design.
Select this model when system requirements demand both substantial FPGA fabric capacity and a powerful embedded processor core. Compare I/O counts and memory sizes against alternative Agilex 7 variants to ensure optimal resource utilization. Validate that the 3184-BGA package fits within the mechanical constraints of the target enclosure.
This component belongs to the Altera Agilex 7 F-Series family, designed for scalable performance in demanding applications. The Agilex architecture combines Intel's 10nm process technology with heterogeneous computing capabilities, enabling efficient integration of hard processor systems alongside flexible logic blocks.
Consult official substitution guides for compatible Agilex 7 devices with similar logic densities or package footprints. Verify that any alternative part maintains compatibility with existing software toolchains and hardware designs.