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The AGFA027R25A2I3E is an Agilex 7 F-Series System-on-Chip FPGA featuring a 2.7M logic element fabric and an integrated quad-core ARM Cortex-A53 processor cluster with NEON and floating-point units. It supports operation up to 1.4GHz, includes 256KB of embedded RAM, and provides 720 I/Os within a 3184-ball BGA package measuring 56x45mm. The device operates at junction temperatures between 0°C and 100°C.
Verify the specific suffix configuration against official datasheets to confirm pinout compatibility and thermal characteristics. Confirm moisture sensitivity level (MSL) requirements for PCB assembly processes. Check for any published customer advisories or design rule changes affecting this specific revision before finalizing procurement plans.
Select this component when both high-performance programmable logic and embedded application processing are required in a single die. Ensure the 3184-BGA footprint fits the mechanical constraints. Validate that the 1.4GHz processor speed meets real-time processing demands for the target application workload.
This part belongs to the Altera Agilex 7 F-Series family, designed for high-performance computing and AI applications. It combines traditional FPGA flexibility with embedded processor capabilities, targeting complex system integration needs where reconfigurability and deterministic performance are critical.
Publicly confirmed direct substitutes are not available in the provided documentation. Engineering changes may require verification of pin-to-pin compatibility and firmware migration efforts if replacing with other Agilex variants.