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The AGFA027R31C2E1V is an Agilex F-series System-on-Chip FPGA featuring a hybrid architecture with 2,692,000 logic elements and a quad-core ARM Cortex-A53 processor operating at 1.4 GHz. It integrates 256 KB of RAM and supports up to 720 I/Os within a 3184-ball BGA package measuring 56x45 mm. The device operates within a junction temperature range of 0°C to 100°C and includes hardware security features via CoreSight.
Verify the specific suffix configuration against official Altera documentation to ensure correct speed grade and temperature rating. Confirm moisture sensitivity level handling requirements during storage and assembly. Check for recent Product Change Notices regarding labeling or packaging updates before finalizing procurement specifications.
Select this component when system requirements demand significant parallel processing capability alongside general-purpose computing tasks. Ensure the design accommodates the 3184-BGA footprint and thermal dissipation needs for the 56x45 mm package. Validate that the available I/O count meets interface requirements without excessive multiplexing.
This part belongs to the Agilex 7 F-Series family, designed for mid-to-high-end applications balancing performance and power efficiency. It sits between lower-density models like the AGFA019 and higher-capacity variants, offering a balanced resource set for complex embedded logic designs.
Direct functional replacements within the same package are limited due to unique pinout configurations. Consider adjacent density parts in the Agilex F series only if I/O mapping allows retargeting. Verify software compatibility with existing Quartus Prime projects when evaluating alternative densities.