AGFA027R31C2E3V

Overview

The AGFA027R31C2E3V is an Agilex 7 F-Series System-on-Chip FPGA featuring a 2.7M logic element fabric and a quad-core ARM Cortex-A53 processor running at 1.4GHz. It integrates 256KB of RAM, supports up to 720 I/Os, and operates within a junction temperature range of 0°C to 100°C. The device utilizes a 3184-ball BGA package with dimensions of 56x45mm.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology
• Provides high-density programmable logic with 2.7 million logic elements
• Supports diverse connectivity including Ethernet, USB OTG, and SPI interfaces

Applications

• High-performance embedded computing systems requiring mixed processing and logic
• Industrial automation controllers utilizing integrated real-time processing
• Communication infrastructure nodes leveraging flexible I/O configurations

Procurement Notes

Verify the specific suffix codes against official Intel/Altera documentation to confirm package type, temperature grade, and speed bin accuracy. Confirm moisture sensitivity levels and recommended reflow profiles prior to assembly. Ensure design tools match the Agilex 7 family requirements for proper configuration and bitstream generation.

Selection Notes

Select this model for applications demanding significant FPGA fabric alongside embedded ARM processing capabilities. Compare logic density and I/O counts against smaller Agilex variants if resource usage is lower. Verify that the 3184-BGA footprint aligns with existing PCB layout constraints and thermal management strategies.

Part Context

This component belongs to the Intel Agilex 7 F-Series, designed for cost-effective yet high-performance SoC implementations. It combines traditional FPGA flexibility with hardened ARM processor cores, targeting mid-to-high volume embedded markets. The series emphasizes power efficiency and integration density compared to previous generations.