AGFA027R31C2I3V

Overview

The AGFA027R31C2I3V is an Agilex 7 F-Series System on Chip FPGA featuring 2,692,000 logic elements. It integrates a quad-core ARM Cortex-A53 processor with CoreSight and NEON support operating at 1.4 GHz. The device utilizes a 3184-ball BGA package measuring 56x45 mm. It supports industrial temperature ranges from -40°C to 100°C junction temperature and includes 256 KB of embedded RAM.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with floating-point capabilities
• Provides high-density programmable logic with approximately 2.7 million logic elements
• Supports diverse connectivity interfaces including Ethernet, USB OTG, and SPI

Applications

• High-performance embedded computing systems requiring mixed processing and logic
• Industrial automation controllers demanding robust I/O connectivity
• Network infrastructure equipment utilizing integrated Ethernet and serial interfaces

Procurement Notes

Verify the specific suffix codes against official Altera documentation to confirm package type and temperature rating. Confirm moisture sensitivity level requirements for your assembly process. Check for any pending product change notices regarding labeling or design revisions before finalizing procurement plans.

Selection Notes

Select this component when both substantial FPGA fabric resources and embedded ARM processing are required in a single die. Compare I/O counts and package dimensions against board space constraints. Ensure the 1.4 GHz processor speed meets real-time control requirements alongside the logic capacity needs.

Part Context

This part belongs to the Agilex 7 F-Series family, designed for scalable performance in complex SoC applications. It combines traditional FPGA flexibility with hardened processor cores, targeting markets that require rapid prototyping and high-volume production efficiency within the Altera ecosystem.

Replacement Considerations

Consult official substitution guides for pin-compatible alternatives within the same Agilex 7 series. Verify that any replacement maintains identical package dimensions and thermal characteristics. Cross-reference logic element counts to ensure functional parity.