AGFA027R31C3E3E

Overview

The AGFA027R31C3E3E is an Agilex 7 F-Series System on Chip FPGA featuring approximately 2.7 million logic elements. It integrates a quad-core ARM Cortex-A53 processor with CoreSight, NEON, and floating-point capabilities. The device operates at speeds up to 1.4 GHz and includes 256 KB of RAM. It utilizes a 3184-ball BGA package measuring 56x45 mm with exposed pads. The component supports a junction temperature range of 0°C to 100°C and exhibits moisture sensitivity.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debugging support
• Provides high-density programmable logic fabric for complex digital designs
• Supports diverse connectivity interfaces including Ethernet, USB OTG, and SPI

Applications

• High-performance embedded computing systems requiring mixed processing and logic
• Industrial automation controllers with real-time processing needs
• Telecommunications infrastructure equipment
• Advanced networking gateways and routers

Procurement Notes

Verify the specific suffix codes (e.g., E3E) against official Altera documentation to confirm exact speed grades and package variants. Confirm RoHS compliance status through current datasheets as regulatory details may update. Ensure handling procedures account for the specified moisture sensitivity level during storage and assembly to prevent damage.

Selection Notes

Select this model when design requirements exceed the capacity of lower-density Agilex devices but do not necessitate larger form factors. Evaluate the 3184-BGA footprint constraints against PCB layout capabilities. Compare performance metrics against alternative SoC architectures if specific ARM core integration is not mandatory for the application.

Part Context

This component belongs to the Agilex 7 F-Series family, designed for scalable performance in demanding applications. It combines traditional FPGA flexibility with embedded processor power, enabling heterogeneous computing architectures. The series targets markets requiring high throughput and low latency within a single silicon solution.

Replacement Considerations

Direct replacements within the same package and pinout are limited to other Agilex 7 F-Series variants with compatible I/O counts. Verify functional equivalence of the embedded ARM cores and logic density before substituting with higher or lower density models from the same manufacturer.