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The AGFB006R16A2E2VB is an Agilex F-series System on Chip FPGA featuring a quad-core ARM Cortex-A53 processor with CoreSight and NEON support. It integrates 573K logic elements within a 1546-ball FBGA package. The device operates at speeds up to 1.4GHz with a junction temperature range of 0°C to 100°C. It includes 256KB RAM, DMA and WDT peripherals, and supports interfaces such as Ethernet, USB OTG, SPI, I2C, and UART.
Verify the specific suffix 'V' against official Altera documentation to confirm any distinct manufacturing or environmental specifications compared to non-V variants. Confirm moisture sensitivity level (MSL 3) requirements for your assembly process. Check current availability status as supply may be restricted or subject to allocation. Ensure compatibility with Quartus Prime software versions supporting the Agilex F series.
Select this SoC variant when both high-performance ARM processing and substantial FPGA resources are required in a single component. Compare the 573K LE count against application complexity to ensure sufficient logic capacity. Evaluate the 1.4GHz operating frequency against timing constraints. Consider the 1546-ball FBGA package size and pin count for PCB layout feasibility and thermal management strategies.
This component belongs to the Agilex 7 F-Series family, designed for mid-to-high performance applications. It combines the flexibility of FPGA technology with the efficiency of an embedded ARM processor. The Agilex platform utilizes Intel's 10nm SuperFin process technology to deliver improved power efficiency and performance density compared to previous generations.
Direct replacements within the same package and functionality include other Agilex F-series SoC devices with similar logic counts, such as the AGFB006R16A2E3V. Verify pin-to-pin compatibility and electrical characteristics before substitution. Consult official cross-reference guides for potential obsolescence or lifecycle changes.