AGFB006R16A2I1VB

AGFB006R16A2I1VB

$9,729.14
  • Description:IC FPGA AGILEX-F 1546BGA
  • Series:Agilex F

SKU:5ce7448c4150 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 1546BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 573K Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1546-BFBGA Exposed Pad
  • Supplier Device Package:1546-BGA (37.5x34)

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AGFB006R16A2I1VB

Overview

The AGFB006R16A2I1VB is an Agilex 7 F-series System on Chip FPGA manufactured by Altera. It integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point units, alongside 573K logic elements. The device operates at speeds up to 1.4GHz and features 384 I/Os within a 1546-pin FBGA package. It includes 256KB RAM and supports interfaces such as Ethernet, USB OTG, and SPI.

Feature Summary

  • Integrated quad-core ARM Cortex-A53 MPCore processor with CoreSight technology
  • High-performance FPGA fabric with 573K logic elements
  • Support for diverse connectivity including Ethernet, USB OTG, and MMC/SD/SDIO
  • Designed for complex embedded systems requiring mixed processing and programmable logic

Applications

  • 6G AI RAN infrastructure
  • O-RAN Radio Unit (Macro & Micro)
  • vRAN and Fronthaul networks

Procurement Notes

Verify the specific suffix 'I1VB' against official Altera documentation to confirm pinout and electrical characteristics, as suffixes often denote package or temperature variations. Confirm moisture sensitivity level (MSL 3) handling requirements during assembly. Check for any active Process Change Notifications (PCNs) related to labeling or design revisions that may affect mechanical fit or compatibility.

Selection Notes

Select this component when a high-density SoC FPGA is required with integrated ARM processing capabilities. Ensure the design utilizes the 1546-pin FBGA footprint and meets the thermal requirements for a junction temperature range of 0°C to 100°C. Verify that the 384 available I/Os and internal memory resources satisfy the system's bandwidth and storage needs.

Part Context

This part belongs to the Agilex 7 F series, targeting high-performance embedded applications. It combines Altera's FPGA architecture with ARM processors, offering a scalable solution for communications and industrial markets. The series emphasizes power efficiency and performance density compared to previous generations.

Replacement Considerations

Publicly confirmed direct substitutes are not identified in the provided source material. Evaluate other Agilex 7 F-series variants for pin-compatible options if available, ensuring logical resource counts and processor configurations meet the original design specifications.

AGFB006R16A2I1VBAGFB006R16A2I1VB
$9,729.14
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