AGFB006R24C2E2VB

AGFB006R24C2E2VB

$7,802.17
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:a2a199c14a65 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 573K Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFB006R24C2E2VB

Overview

The AGFB006R24C2E2VB is an Agilex F-series System on Chip FPGA featuring a 573K logic element fabric. It integrates a quad-core ARM Cortex-A53 processor running at 1.4GHz with NEON and floating-point capabilities. The device utilizes a 2340-ball FBGA package measuring 45x42 mm, providing 576 I/Os. It includes 256KB of embedded RAM and supports standard operating temperatures from 0°C to 100°C TJ.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug support
  • Combines 573K logic elements with high-speed programmable transceivers
  • Supports extensive peripheral connectivity including Ethernet, USB OTG, and SPI

Applications

  • High-performance industrial automation controllers
  • Telecommunications infrastructure equipment
  • Advanced automotive infotainment systems
  • Medical imaging processing units

Procurement Notes

Verify the specific suffix codes against official Altera documentation to ensure correct temperature range and packaging specifications. Confirm moisture sensitivity level requirements for your assembly process. Check for any pending product change notices regarding labeling or design revisions before finalizing procurement plans.

Selection Notes

Select this model when requiring a balance of substantial FPGA fabric and embedded processing power within a compact footprint. Ensure your design accommodates the 2340-ball BGA thermal dissipation requirements. Compare against other Agilex F variants if higher logic density or different I/O counts are needed.

Part Context

This component belongs to the Agilex 7 F-Series family, designed for applications demanding high performance and low power consumption. It represents a convergence of programmable logic and hard processor systems, enabling complex system integration on a single die for next-generation electronic solutions.

AGFB006R24C2E2VBAGFB006R24C2E2VB
$7,802.17
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