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The AGFB006R24C2E3V is an Agilex F-series System on Chip FPGA featuring a quad-core ARM Cortex-A53 processor with CoreSight, NEON, and floating-point units. It integrates 573K logic elements and provides 576 I/Os. The device operates at speeds up to 1.4GHz and includes 256KB of RAM. It supports interfaces such as Ethernet, USB OTG, SPI, UART, and MMC/SD/SDIO. The component is housed in a 2340-pin FBGA package with a junction temperature range of 0°C to 100°C.
Verify the specific suffix E3V against official Altera documentation to confirm pinout compatibility and thermal specifications. Confirm moisture sensitivity level (MSL 3) handling requirements during assembly. Ensure design files match the exact revision indicated by the ordering code. Cross-reference with current customer advisories for any packaging or labeling updates.
Select this model when a balance of embedded ARM processing power and moderate FPGA logic density is required. The 2340-pin FBGA package suits high-I/O count designs. Compare against other Agilex F variants if higher logic capacity or different processor configurations are needed. Validate that the 1.4GHz speed grade meets system timing constraints.
This component belongs to the Agilex 7 F-Series family, specifically the AGF006 logic density tier. It represents a convergence of hard processor systems and programmable logic within a single die. The Agilex architecture utilizes Intel's 10nm process technology to deliver performance efficiency for edge computing and infrastructure workloads.
Publicly confirmed direct substitutes are not available in the provided source material. Alternative selection requires evaluating other Agilex F-series devices with comparable logic counts and processor cores. Verify mechanical footprint and electrical characteristics before considering any cross-family migration.