AGFB006R24C2I2VB

AGFB006R24C2I2VB

$9,362.80
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:2f5621638712 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 573K Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFB006R24C2I2VB

Overview

The AGFB006R24C2I2VB is an Agilex 7 F-Series System on Chip integrating a four-core ARM Cortex-A53 processor with FPGA fabric. It features 573K logic elements and operates at speeds up to 1.4GHz. The device includes 256KB of embedded RAM and supports various connectivity interfaces including Ethernet, USB OTG, and SPI. It is housed in a 2340-pin FBGA package suitable for high-density applications.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug support
  • Combines FPGA fabric with embedded processing capabilities for heterogeneous computing
  • Supports multiple peripheral interfaces including Ethernet, I2C, and MMC/SD

Applications

  • High-performance embedded systems requiring real-time processing
  • Industrial automation controllers with mixed signal requirements
  • Telecommunications infrastructure equipment
  • Advanced automotive infotainment and driver assistance systems

Procurement Notes

Verify the specific suffix codes (C2I2VB) against official Altera documentation to confirm temperature range and package variant accuracy. Ensure compatibility with existing board designs regarding pinout and thermal requirements. Confirm moisture sensitivity level handling procedures during assembly to prevent damage. Cross-reference part numbers with current manufacturer advisories for any recent labeling or design changes.

Selection Notes

Select this component when a combination of programmable logic and hard processor system is required within a single die. Consider the 2340-pin footprint for PCB layout constraints and thermal dissipation needs. Evaluate the 573K LE capacity against application complexity to ensure sufficient resources. Verify that the operating temperature range meets environmental specifications for the target deployment scenario.

Part Context

This device belongs to the Agilex 7 F-Series family, designed for scalable performance and power efficiency. It represents a convergence of FPGA flexibility and processor integration, targeting complex embedded applications. The series emphasizes high-speed interconnects and robust security features for modern electronic systems.

AGFB006R24C2I2VBAGFB006R24C2I2VB
$9,362.80
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