AGFB006R24C3I3E

AGFB006R24C3I3E

$6,687.81
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:be87563e1edc Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 573K Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB006R24C3I3E

Overview

The AGFB006R24C3I3E is an Agilex F-series System on Chip integrating a four-core ARM Cortex-A53 processor with FPGA fabric. It features 573K logic elements and operates at speeds up to 1.4GHz. The device includes 256KB of embedded RAM and supports multiple peripheral interfaces including Ethernet, USB OTG, and SPI. It is housed in a 2340-ball FBGA package suitable for high-density applications.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point units
  • Provides 573K logic elements within the Agilex F FPGA fabric
  • Includes 256KB of embedded memory and diverse connectivity peripherals

Applications

  • High-performance embedded computing systems requiring mixed processing and programmable logic
  • Industrial automation controllers utilizing integrated Ethernet and serial interfaces
  • Communication infrastructure nodes leveraging SoC capabilities for protocol acceleration

Procurement Notes

Verify the specific suffix configuration against official Altera documentation to ensure correct speed grade and temperature rating. Confirm moisture sensitivity level requirements during storage and handling. Check for any recent product change notices regarding labeling or packaging updates before finalizing procurement specifications.

Selection Notes

Select this component when a unified solution combining application processing and hardware acceleration is required. Evaluate the 573K LE capacity against design complexity to ensure sufficient resources. Consider the 2340-ball FBGA footprint for PCB layout constraints and thermal management needs relative to the 1.4GHz operational frequency.

Part Context

This part belongs to the Agilex 7 F-Series family, designed to bridge the gap between traditional processors and FPGAs. It targets applications needing low latency and high throughput by allowing custom hardware blocks to interface directly with the ARM processor core via high-speed interconnects.

Replacement Considerations

Consult official substitution guides for pin-compatible alternatives within the Agilex portfolio. Verify that any replacement maintains the same FBGA-2340 package dimensions and ball mapping to ensure mechanical compatibility without redesigning the carrier board.

AGFB006R24C3I3EAGFB006R24C3I3E
$6,687.81
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