AGFB008R24C2E3V

AGFB008R24C2E3V

$8,079.28
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:6d01b2a835fe Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 764K Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB008R24C2E3V

Overview

The AGFB008R24C2E3V is an Agilex F series System on Chip integrating a 764K logic element FPGA fabric with a quad-core ARM Cortex-A53 processor running at 1.4GHz. It features 256KB RAM, 576 I/Os, and supports EBI/EMI, Ethernet, USB OTG, and other interfaces in a 2340-BGA package.

Feature Summary

  • Integrates Agilex F FPGA fabric with quad-core ARM Cortex-A53 MPCore processor
  • Includes CoreSight debug infrastructure and ARM NEON SIMD capabilities
  • Supports diverse connectivity including Ethernet, USB OTG, and external memory interfaces

Applications

  • Industrial automation controllers requiring real-time processing
  • Telecommunications baseband processing units
  • Medical imaging system control boards
  • Automotive infotainment and instrument clusters

Procurement Notes

Verify the specific suffix E3V against official Altera documentation to confirm temperature range and package variant. Confirm moisture sensitivity level (MSL) requirements for your assembly process. Check for any Process Change Notifications affecting labeling or mechanical dimensions before finalizing procurement specifications.

Selection Notes

Select this part when combining high-performance soft-core processing with flexible FPGA logic is required. Compare logic density and I/O count against AGFA008R24C2I3V if only FPGA functionality is needed. Ensure board design accommodates the 2340-BGA footprint and thermal dissipation needs for the integrated SoC architecture.

Part Context

This component belongs to the Agilex F family, designed for cost-sensitive applications requiring embedded processing. It shares architectural similarities with other Agilex devices but offers specific integration of ARM cores within the FPGA fabric, distinguishing it from pure FPGA variants like the AGFD series.

Replacement Considerations

Publicly confirmed direct substitutes are not available in the provided source material. Cross-referencing with AGFA008R24C2I3V may be necessary if software compatibility allows, though pinouts and features may differ. Consult Altera support for validated replacement options.

AGFB008R24C2E3VAGFB008R24C2E3V
$8,079.28
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