AGFB008R24C2I1V

Overview

The AGFB008R24C2I1V is an Agilex F series System-on-Chip FPGA featuring a 764K logic element fabric. It integrates a quad-core ARM Cortex-A53 processor with CoreSight, NEON, and floating-point units. The device operates at speeds up to 1.4GHz and includes 256KB of embedded RAM. It supports I/O counts of 576 within a 2340-BGA package. Operating temperature ranges from -40°C to 100°C TJ.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point capabilities
• Combines 764K logic elements with embedded system-on-chip architecture
• Supports high-speed connectivity including Ethernet, USB OTG, and SPI interfaces

Applications

• Industrial automation controllers requiring mixed programmable logic and processing
• Edge computing nodes utilizing integrated ARM cores for data preprocessing
• Communication infrastructure equipment leveraging high-speed serial interfaces

Procurement Notes

Verify the specific suffix 'V' against official Altera documentation to confirm voltage or packaging variations. Confirm moisture sensitivity level (MSL 3) requirements for your assembly line. Check for any recent Product Change Notices regarding labeling or design revisions before finalizing procurement specifications.

Selection Notes

Select this model when a balance of moderate logic density and embedded processing is required. Compare the 764K LE count against larger Agilex variants if higher performance is needed. Ensure the 2340-BGA footprint fits your board layout constraints and thermal management strategy.

Part Context

This component belongs to the Agilex 7 F family, designed for applications needing both hardware configurability and software-defined processing. It sits alongside other Agilex devices offering varying logic densities and memory configurations within the same ecosystem.

Replacement Considerations

Direct substitutes include other Agilex F series parts like AGFA008R24C2I1V for pure FPGA needs or AGFB027R24C2I1V for higher capacity. Verify pin compatibility and thermal characteristics when migrating between different logic densities in the same package.