AGFB008R24C2I3E

Overview

The AGFB008R24C2I3E is an Agilex F series System-on-Chip FPGA featuring a quad-core ARM Cortex-A53 processor running at 1.4 GHz. It integrates 764,000 logic elements within a 2340-ball BGA package. The device supports embedded memory including 256 KB of RAM and includes standard peripherals such as DMA and WDT. Operating temperature range extends from -40°C to 100°C TJ.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology
• Combines FPGA fabric with high-performance processing subsystem on a single chip
• Supports diverse connectivity interfaces including Ethernet, USB OTG, and SPI

Applications

• Industrial automation controllers requiring real-time processing
• Edge computing nodes for data aggregation and preprocessing
• Automotive infotainment and instrument cluster systems
• Telecommunications baseband processing units

Procurement Notes

Verify the specific suffix I3E against official Altera documentation to confirm pinout compatibility and thermal characteristics. Confirm moisture sensitivity level requirements for your assembly process. Ensure design tools support the Agilex F family architecture before procurement.

Selection Notes

Select this model when both programmable logic density and embedded ARM processing are required in a compact form factor. Compare logic element counts against application complexity. Verify that the 2340-BGA package fits within board space constraints and thermal management capabilities.

Part Context

This component belongs to the Agilex F family, designed for cost-effective SoC implementations. It bridges the gap between traditional FPGAs and microprocessors by integrating hardened ARM cores directly into the silicon die alongside configurable logic blocks.

FAQ

What is the maximum operating junction temperature?

The device operates within a junction temperature range of -40°C to 100°C.

Does the part include embedded memory?

Yes, the AGFB008R24C2I3E includes 256 KB of embedded RAM.