AGFB008R24D1I3V

AGFB008R24D1I3V

$8,665.79
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:d2de9345319b Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 764K Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFB008R24D1I3V

Overview

The AGFB008R24D1I3V is an Agilex 7 F-Series System on Chip FPGA manufactured by Altera. It integrates a hard processor system featuring a quad-core ARM Cortex-A53 MPCore with CoreSight, NEON, and floating-point units alongside programmable logic resources. The device provides 764K logic elements and operates within a junction temperature range of -40°C to 100°C. It utilizes a 2340-ball BGA package measuring 45x42 mm, supporting high-density interconnects for complex embedded applications.

Feature Summary

  • Integrated quad-core ARM Cortex-A53 hard processor system with NEON and floating-point capabilities
  • High-performance FPGA fabric containing 764K logic elements
  • Supports diverse connectivity including Ethernet, USB OTG, SPI, I2C, and UART/USART
  • Includes on-chip DMA and watchdog timer peripherals

Applications

  • Industrial automation controllers requiring real-time processing
  • Telecommunications infrastructure equipment
  • Medical imaging systems
  • Automotive infotainment and instrument clusters

Procurement Notes

Verify the specific suffix 'I3V' against official Altera documentation to confirm industrial temperature rating and package variant. Confirm RoHS compliance status through current datasheets as environmental certifications may undergo revision. Ensure design files match the exact part number to avoid pinout mismatches in the 2340-BGA footprint.

Selection Notes

Select this component when both high-end DSP capabilities and embedded processing are required in a single die. Compare logic density against Agilex 7 M-Series if lower cost is prioritized over performance. Verify that the 2340-ball package fits the board space constraints and thermal management requirements for the target operating environment.

Part Context

This part belongs to the Agilex 7 F-Series family, designed for high-performance computing and data center applications. It sits above the Agilex 5 series in performance hierarchy while offering distinct hard processor integration compared to pure FPGA variants. The F-Series targets demanding workloads requiring low latency and high throughput.

Replacement Considerations

Direct replacements include other Agilex 7 F-Series devices with compatible pinouts such as AGFA008R24D1I3V or higher-density variants like AGFB008R24D2I3V. Cross-family migration to Agilex 5 requires significant retiming and resource adjustment. Always validate electrical characteristics and software IP compatibility before substitution.

AGFB008R24D1I3VAGFB008R24D1I3V
$8,665.79
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