AGFB012R24B2E4X

Overview

The AGFB012R24B2E4X is an FPGA from the Agilex 7 F-Series, specifically the AGF012 device variant. It provides 1,178,000 logic elements for high-density programmable logic applications. The component utilizes a FineLine Ball-Grid Array (FBGA) package with 2340 pins and operates under moisture-sensitive handling protocols.

Feature Summary

• High-density logic capacity within the Agilex 7 family
• FineLine Ball-Grid Array (FBGA) flip-chip packaging
• Integrated support for advanced I/O standards

Applications

• High-performance computing infrastructure
• Telecommunications baseband processing
• Industrial automation control systems

Procurement Notes

Verify the specific ordering suffix against official Altera documentation to confirm pinout and electrical characteristics. Confirm RoHS compliance status and humidity sensitivity requirements prior to assembly. Check current supply availability as distribution may be restricted in certain regions.

Selection Notes

Select this part for designs requiring approximately 1.1 million logic elements. Ensure the PCB layout supports the 2340-pin FBGA footprint. Validate thermal management solutions for the specific package type and operating environment.

Part Context

This component belongs to the Agilex 7 F-Series, representing a generation of FPGAs designed for scalable performance. The AGF012 designation indicates the specific silicon density tier within the broader Agilex portfolio, offering a balance of logic resources and power efficiency.