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The AGFB012R24B3E3E is an Agilex F-series System on Chip FPGA manufactured by Altera. It integrates a quad-core ARM Cortex-A53 processor with 573K logic elements. The device operates at frequencies up to 1.4GHz and includes 256KB of embedded RAM. It supports multiple connectivity interfaces including Ethernet, USB OTG, and SPI. The component is housed in a 2340-ball FBGA package and functions within a junction temperature range of 0°C to 100°C.
Verify the specific suffix B3 against official Altera documentation to confirm silicon revision and electrical characteristics. Confirm moisture sensitivity level and reflow soldering profile requirements prior to assembly. Ensure compatibility with Quartus Prime software versions supporting the Agilex F-Series architecture for successful configuration and programming.
Select this model when both high-performance ARM processing and substantial FPGA fabric are required in a single package. Compare logic density and processor speed against other Agilex F-Series variants like the AGFA series if SoC integration is not needed. Evaluate thermal management solutions suitable for the 2340-ball FBGA package under maximum operating temperatures.
This component belongs to the Agilex F-Series family, which combines Intel's FPGA technology with ARM processor cores. It serves as a bridge between traditional programmable logic and embedded computing, allowing developers to implement custom hardware accelerators alongside general-purpose processing tasks within a unified system architecture.
Direct replacements within the same package and pinout must be sought from the Agilex F-Series lineup. Verify that alternative part numbers maintain identical processor core configurations and logic element counts. Cross-reference pin assignments and electrical specifications to ensure functional equivalence without board redesign.