SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AGFB012R24C2I3E is a System-on-Chip Field Programmable Gate Array belonging to the Intel Agilex 7 F-Series family. It integrates programmable logic fabric with embedded processor subsystems on a single die. The device utilizes an FBGA-2581 package configuration for high-density interconnectivity. Key specifications include 1,178,000 Logic Elements and support for advanced I/O standards. The component is classified as moisture sensitive and requires appropriate handling during assembly processes.
Verify the specific ordering suffix against official Intel documentation to confirm package type and temperature grade. Ensure compliance with RoHS directives and check for any active customer advisories or process change notifications that may affect manufacturing details before finalizing procurement orders.
Compare this SoC FPGA variant against pure logic-only models in the Agilex 7 series if embedded processing is not required. Evaluate pin count requirements against the FBGA-2581 footprint constraints. Confirm thermal management solutions are adequate for the specific power consumption profile of the chosen logic utilization level.
This component belongs to the Agilex 7 F-Series, which targets high-end applications requiring significant logic density combined with processing power. It sits alongside other variants like the AGFA series, differing primarily in the inclusion of embedded processor subsystems rather than pure programmable logic fabric alone.
Direct replacements within the same package and pinout include other Agilex 7 F-Series devices such as AGFB012R24C2E3E or AGFB012R24D2I3E, provided functional compatibility with the embedded subsystem is verified.