AGFB012R24C3I3E

AGFB012R24C3I3E

$11,220.01
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:2760a5d6bb26 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.2M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB012R24C3I3E

Overview

The AGFB012R24C3I3E is a System-on-Chip FPGA belonging to the Agilex 7 F series, manufactured by Altera. It integrates programmable logic fabric with embedded processing capabilities. The device features approximately 1.2 million logic elements and utilizes an FBGA-2340 package for surface mount installation. It supports high-speed I/O configurations and includes integrated memory resources suitable for complex digital system implementations.

Feature Summary

  • Integrates ARM Cortex-A53 processor cores within the FPGA fabric
  • Supports high-bandwidth memory interfaces for data-intensive applications
  • Features advanced transceiver technology for serial communication
  • Includes hardware security engines for secure boot and encryption

Applications

  • High-performance networking infrastructure equipment
  • Industrial automation control systems
  • Medical imaging signal processing units
  • Test and measurement instrumentation

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to ensure compatibility with required temperature grades and package options. Confirm availability status directly with authorized distributors as supply levels fluctuate. Ensure compliance with RoHS directives and moisture sensitivity level requirements during storage and handling procedures prior to assembly.

Selection Notes

Compare the logic element count and embedded memory size against project requirements to determine if this model or a variant within the Agilex 7 family offers optimal resource utilization. Evaluate pin count and I/O voltage standards to match board interface specifications. Consider thermal dissipation needs associated with the FBGA-2340 package when designing the PCB layout and cooling strategy.

Part Context

This component is part of the Agilex 7 portfolio, representing a transition toward hybrid architecture combining FPGA flexibility with processor efficiency. It succeeds previous generations like Arria 10 in performance density. The Agilex 7 series targets applications requiring low latency and high throughput, leveraging TSMC process technology for improved power efficiency compared to legacy nodes.

Replacement Considerations

Direct replacements may include other Agilex 7 models with adjusted logic densities such as AGFA012 variants or AGFB014. Cross-family migration from Arria 10 requires significant IP revalidation. Verify pin-to-pin compatibility and software toolchain support before substituting.

AGFB012R24C3I3EAGFB012R24C3I3E
$11,220.01
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