AGFB012R24D2I3V

AGFB012R24D2I3V

$10,694.75
  • Description:AGFB012R24D2I3V
  • Series:Agilex F

SKU:bf5cfcf93f0e Category: Brand:

  
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Product Detailed Parameters

  • Description:AGFB012R24D2I3V
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.2M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFB012R24D2I3V

Overview

The Altera AGFB012R24D2I3V is a System on Chip FPGA belonging to the Agilex 7 F-Series. It integrates an ARM Cortex-A53 processor with programmable logic fabric. The device features 1,178,000 Logic Elements and includes embedded memory resources. It utilizes a 2340-ball BGA package with dimensions of 45x42 mm. The component supports high-speed transceivers and various peripheral interfaces for complex system integration.

Feature Summary

  • Integrates quad-core ARM Cortex-A53 MPCore processors with NEON and floating-point units
  • Provides extensive programmable logic fabric with dedicated DSP blocks
  • Supports high-speed serial connectivity through integrated transceiver PHYs
  • Includes comprehensive security features and debug interfaces

Applications

  • High-performance networking infrastructure equipment
  • Industrial automation and control systems
  • Medical imaging and diagnostic devices
  • Test and measurement instrumentation

Procurement Notes

Verify the specific suffix I3 against official datasheets to confirm industrial temperature range compliance. Confirm package availability and lead times directly with authorized distributors as supply status varies. Ensure ESD handling protocols are followed during receipt and storage due to moisture sensitivity classification.

Selection Notes

Select this model when both processing power and flexible logic resources are required in a single chip. Compare logic density and transceiver speeds against other Agilex 7 variants to match performance needs. Evaluate thermal requirements based on the 2340-BGA package constraints and intended operating environment.

Part Context

This part belongs to the Agilex 7 family, representing Intel's advanced FPGA architecture. It succeeds previous generations by offering improved performance per watt and higher integration levels. The F-Series specifically targets applications requiring combined processing and programmability capabilities.

Replacement Considerations

Direct substitutes within the same package and pinout include AGFA012R24D2I3V or AGFB012R24D2E3V depending on commercial vs industrial grade requirements. Cross-family migration from Stratix or Arria devices requires significant design adaptation.

AGFB012R24D2I3VAGFB012R24D2I3V
$10,694.75
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