AGFB014R24C2E2VAA

Overview

The Altera AGFB014R24C2E2VAA is a System-on-Chip (SoC) device belonging to the Agilex F series, integrating an FPGA fabric with an embedded ARM processor core. The FPGA section provides 1.4 million logic elements for high-density programmable logic applications. The embedded processor consists of a quad-core ARM Cortex-A53 MPCore featuring CoreSight debug capabilities and NEON multimedia extensions. The device operates within a junction temperature range of 0°C to 100°C and utilizes a 2340-ball Ball Grid Array (BGA) package measuring 45x42 mm.

Feature Summary

• Integrates a high-capacity FPGA fabric with 1.4 million logic elements alongside a multi-core ARM processor subsystem on a single die.
• Features a quad-core ARM Cortex-A53 MPCore processor equipped with CoreSight technology for comprehensive system debugging and trace capabilities.
• Supports extensive connectivity interfaces including Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, and EBI/EMI memory controllers.

Applications

• High-performance industrial automation and control systems requiring deterministic logic processing.
• Network infrastructure equipment utilizing integrated Ethernet and high-speed serial interfaces.
• Embedded computing platforms combining real-time FPGA acceleration with general-purpose ARM processing.

Procurement Notes

Verify the specific suffix 'AA' against official manufacturer documentation, as standard listings typically utilize suffixes such as 'V' or 'VC'. Confirm that the requested variant matches the exact speed grade and package specifications required for your design. Ensure compatibility with the Agilex 7 development tools and verify RoHS compliance status through the latest product change notifications.

Selection Notes

Select this component when designs require significant logic density combined with powerful embedded processing capabilities. The Agilex F series architecture supports advanced signal integrity features suitable for complex digital designs. Evaluate the 2340 BGA package constraints regarding PCB layout and thermal management requirements during the initial hardware design phase.

Part Context

This part belongs to the Agilex 7 family, representing Intel's advanced FPGA portfolio built on a refined 10nm process technology. The Agilex F series specifically targets cost-sensitive applications while maintaining high performance levels comparable to larger families. It serves as a bridge between mid-range Cyclone devices and high-end Stratix solutions.

Replacement Considerations

Direct replacements within the same package include other Agilex F variants such as AGFB014R24C2E2VC. Cross-family migration may involve the AGFA series or Agilex M series, though pinouts and feature sets differ significantly. Verify software toolchain compatibility before substituting with alternative part numbers.