AGFB014R24C2E2VB

AGFB014R24C2E2VB

$15,083.26
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:ac448a71ad39 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.4M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFB014R24C2E2VB

Overview

The AGFB014R24C2E2VB is an Agilex F-series System on Chip (SoC) integrating a programmable fabric with embedded processing cores. It features 1.4 million logic elements within a 2340-ball BGA package measuring 45x42 mm. The device includes a quad-core ARM Cortex-A53 processor running at 1.4 GHz, equipped with CoreSight and NEON capabilities. It contains 256 KB of RAM and supports various interfaces including Ethernet, USB OTG, and SPI. Operating temperatures range from 0°C to 100°C TJ.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor with FPGA fabric for heterogeneous computing
  • Provides high-density programmable logic with 1.4 million logic elements
  • Supports diverse connectivity options including Ethernet, USB OTG, and standard serial interfaces

Applications

  • Embedded systems requiring combined processing and programmable logic
  • Industrial automation controllers
  • Network infrastructure equipment

Procurement Notes

Verify the specific suffix 'VB' against official Intel/Altera documentation to confirm package and temperature grade details. Ensure compatibility with Quartus Prime Pro software versions supporting the Agilex F-Series. Confirm supply chain availability through authorized distributors as lead times may vary.

Selection Notes

Select this model when both high-performance ARM processing and significant FPGA resources are required in a single component. Consider the 2340-BGA footprint for PCB layout constraints. Evaluate thermal management requirements given the 100°C junction temperature limit and power consumption characteristics of the integrated SoC architecture.

Part Context

This part belongs to the Intel Agilex 7 F-Series family, designed for mid-range applications balancing performance and density. It sits alongside other R24 package variants like the C3I3E and D2E3V models, differing primarily in speed grades and commercial/industrial temperature ratings defined by their suffixes.

Replacement Considerations

Direct substitutes include other AGFB014R24 variants such as AGFB014R24C3I3E or AGFB014R24D2E3V, depending on required speed grade and operating temperature range. Verify pin-to-pin compatibility and software configuration compatibility before substitution.

AGFB014R24C2E2VBAGFB014R24C2E2VB
$15,083.26
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