AGFB014R24C2I2V

AGFB014R24C2I2V

$18,099.14
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:9257e28e15ee Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.4M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB014R24C2I2V

Overview

The AGFB014R24C2I2V is an Agilex 7 F-Series Field Programmable Gate Array System on Chip manufactured by Altera. It integrates a 1.4 million logic element FPGA fabric with a quad-core ARM Cortex-A53 processor subsystem featuring CoreSight technology, NEON multimedia extensions, and floating-point units. The device operates within a junction temperature range of 0°C to 100°C and utilizes a 2340-ball Ball Grid Array package measuring 45x42 mm. It supports embedded peripherals including DMA and watchdog timers, alongside connectivity interfaces such as Ethernet, I2C, SPI, UART/USART, USB OTG, and MMC/SD/SDIO.

Feature Summary

  • Integrates high-density programmable logic with embedded processing capabilities
  • Includes ARM Cortex-A53 MPCore processor subsystem with NEON and floating-point support
  • Supports diverse peripheral connectivity and memory interface standards

Applications

  • Embedded systems requiring combined logic and processing
  • Industrial automation controllers
  • Network infrastructure equipment

Procurement Notes

Verify the specific suffix configuration against official datasheets to ensure compatibility with required operating temperatures and package variants. Confirm moisture sensitivity level requirements for handling procedures. Check for any recent product change notices regarding labeling or design revisions before finalizing procurement specifications.

Selection Notes

Select this component when a system requires both substantial programmable logic resources and an integrated application processor. Ensure the 2340-BGA footprint fits the board layout constraints. Verify that the 0°C to 100°C junction temperature range meets the environmental conditions of the target deployment scenario.

Part Context

This part belongs to the Agilex 7 F-Series family, which combines FPGA fabric with ARM processors. It shares the R24C package designation with other devices in the series, offering a standardized form factor for scalable designs across different logic density options within the same ecosystem.

Replacement Considerations

Consult official substitution guides for compatible Agilex 7 F-Series devices with matching pinouts. Verify functional equivalence if replacing with higher or lower logic density variants within the same package family.

AGFB014R24C2I2VAGFB014R24C2I2V
$18,099.14
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