AGFB014R24C3E3E

Overview

The AGFB014R24C3E3E is an Agilex F-series System on Chip (SoC) manufactured by Altera. It integrates a Field Programmable Gate Array with 1.4 million logic elements and a quad-core ARM Cortex-A53 processor running at 1.4 GHz. The device utilizes a 2340-BGA package with dimensions of 45x42 mm. It includes 256 KB of RAM and supports peripherals such as DMA and WDT. Connectivity options encompass EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The operating junction temperature range is specified from 0°C to 100°C.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology and floating-point support within the FPGA fabric.
• Provides high-speed connectivity interfaces including Ethernet, USB OTG, and various serial protocols for system integration.
• Supports external memory interfaces via EBI/EMI controllers for flexible memory architecture design.

Applications

• Embedded systems requiring combined processing and programmable logic capabilities
• Industrial automation controllers utilizing ARM cores for control and FPGA for real-time tasks
• Communication infrastructure equipment leveraging high-speed serial and Ethernet interfaces

Procurement Notes

Verify the specific suffix codes against official datasheets to ensure correct package and temperature ratings. Confirm availability status directly with authorized distributors as stock levels fluctuate. Ensure compliance with RoHS directives and moisture sensitivity level requirements during storage and handling procedures prior to assembly.

Selection Notes

Select this model when 1.4 million logic elements are required alongside embedded ARM processing. Compare against other Agilex F-series variants based on specific logic density and I/O count needs. Ensure the 2340-BGA footprint fits the target PCB layout constraints and thermal management strategy for the intended operating environment.

Part Context

This component belongs to the Agilex 7 F-Series family, designed for high-performance embedded applications. It combines Intel's FPGA architecture with ARM processor subsystems. The R24C designation indicates the specific package type and pin configuration used in this series. This SoC approach allows for heterogeneous computing within a single silicon die.

Replacement Considerations

Direct replacements within the same family include AGFB014R24D2E3V and AGFB014R24C2E2V. Verify pin compatibility and electrical specifications before substitution. Consult official cross-reference guides for any functional differences between suffix variations.