AGFB014R24D1E2V

AGFB014R24D1E2V

$14,140.63
  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F

SKU:5ea4e54f71c5 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2340FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.4M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

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AGFB014R24D1E2V

Overview

The AGFB014R24D1E2V is an Agilex F-Series System on Chip (SoC) FPGA manufactured by Altera. It integrates a quad-core ARM Cortex-A53 MPCore processor subsystem with CoreSight technology, ARM NEON, and floating-point capabilities alongside programmable logic resources totaling 1.4 million logic elements. The device operates at a maximum frequency of 1.4 GHz and includes 256 KB of RAM. It utilizes a 2340-ball Ball Grid Array (BGA) package measuring 45x42 mm. Connectivity features include EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG interfaces.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor subsystem with security and multimedia extensions
  • Provides high-density programmable logic fabric for complex digital design
  • Supports diverse peripheral connectivity including high-speed serial and parallel interfaces

Applications

  • Data center acceleration and compute applications
  • Wireless 5G infrastructure systems
  • Network Function Virtualization (NFV)
  • Automotive electronic control units
  • Industrial and military/aerospace systems

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm temperature range, package variant, and compliance status. Confirm availability through authorized distributors as lead times may vary. Ensure the procurement channel is authorized to guarantee component authenticity and traceability.

Selection Notes

Select this model when a combination of embedded ARM processing and high-capacity FPGA logic is required. Consider the 2340 BGA package dimensions for PCB layout constraints. Evaluate the 1.4M logic element count against design complexity requirements before choosing alternative densities within the Agilex F-Series family.

Part Context

This component belongs to the Agilex 7 F-Series product line, which utilizes Intel's 10nm process technology. The series features next-generation programmable structures with HyperFlex routing architecture and supports transceivers up to 112 Gbps. It is designed for high-performance computing and networking applications requiring low latency and power efficiency.

Replacement Considerations

Consult official substitution guides for compatible Agilex F-Series devices with similar logic density or package footprints. Verify pin-to-pin compatibility and electrical specifications before replacing. No direct public substitute part numbers are confirmed in the provided data.

AGFB014R24D1E2VAGFB014R24D1E2V
$14,140.63
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